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4DS is at crunch point technically. Volume has dried up so a...

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    4DS is at crunch point technically. Volume has dried up so a break should be near (direction unknown).

    They 'meet the maker' on the 18th apparently so should get an update on the progress of their ReRam memory tech and their progress with scaling the manufacture process. The tech itself already proven so the manufacture process is the main hurdle to overcome. If overcome then they have a product for sale in a sector that generally deals in the billions. The attached research note gives a reasonable overview of where they currently sit.

    TA wise support sits around 5.7c, 0.7c below the current SP. Resistance sits around 8.7c

    Worth a read up I believe but won't suit all risk appetites
    4ds_flash_note_1_november_2018.pdf
    Last edited by Michaeljob: 15/01/19
 
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