Ann: Weebit Nano reports results for move to 300mm wafers at 28nm, page-16

So we have ReRAM cells with commercially equivalent production standard stable voltage levels and endurance.

Good to see they are doing the proper step by step evaluations prior to going to 28nm silicon. Leti know what they are doing and that is a huge derisk for WBT as it progresses forward.

This article in eetimes shows why density consideration at design time is important at 28nm:
https://www.eetimes.com/document.asp?doc_id=1279471

A stable platform at 40nm is a good basis for the shrink down.

So far we have:
1. SiOx process, with no exotic material layers, so fab friendly and easier to integrate
2. Sufficient samples at 40nm off 200mm wafer for testing and evaluation. Would be nice to know yield.
3. Plainly sufficient quality out of the run to start simulation/parameter work for inclusion in tCAD tools
4. Excellent retention (10yr+)
5. Endurance and stability at commercial product standards
6. Initial assessments indicate likely below 28nm shrinks possible
7. Clear evidence that the shrink to 28nm on 300mm wafers is progressing well so far
8. Rice shift of royalty payments, Leti re-signup, India AI uni interest

I think its fair to say WBT investors have been rolling with things as they progress. There is no assumption that everything will "just work" out of the box. Expectations are well in check here but it is looking very positive all up so far.