Q1) From the Aug 18, presentation report,
Project timeline end 1st Q 19,
______
Process Optimisation Baseline improvement to achieve robust Technology parameter.
_____
I think this just refers to the 40nm module, could they elaborate on this with any specs/details. Is it now completed?
Q2) The 28nm 300mm integration was projected for Q4, 19.
any chance of that occuring earlier?
Cheers
Ann: Upcoming release of shares subject to voluntary escrow, page-143
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