Ann: Q2FY19 Activities Update and Appendix 4C, page-108

WBT currently says it is initially targeting embedded memory but has made very clear the tech can be used for 3D / stackable memory and a TMT Analytics report I read said there’s no reason why Weebit’s tech cannot be used for storage class memory.

WBT scaled from 1KB to 1MB and that is all that is needed for embedded memory, however if it chose to scale again to 1GB (which it can) then it could target storage memory.

The reason WBT has stopped at 1MB and is targeting 28nm is that there is an explosion in demand for this particular kind of memory atm that others are not able to address anywhere near as cost-effectively as WBT can with its silicon oxide solution.

WBT is pursuing an early mover (early to market) strategy

...

As for storage class memory, Intel’s solution is failing due to cost and if Intel can’t do it (cost-effectively) using non-silicon materials than guess what neither can 4DS who by the way is shooting for the dinosaur 40nm wafers and has only achieved “functional” results and on the *second* attempt.

WBT by contrast is already shipping ‘chips’ to universities and possibly even fabs by now as it seeks to narrow down the best key industry partner for its immediate future.

PS. WBT’s new target of 28nm is an interesting one. It really does narrow it down to Samsung, ST or possibly Intel (and if it is Intel it might explain why Intel is spending $10B of its hard-earned on a new plant in Israel where WBT is based)

Opinion only, dyor etc