I can't understand what you guys are going on about!The...

I can't understand what you guys are going on about!

The objective with this iteration was to produce functional 300mm wafers for testing.  The first iteration was a failure.  The second most recent iteration was a success.  Now we wait for the results of 4DS testing of these wafers with results due prior to end Q1.  If testing is successful they then move onto the IMEC fabrication of 1 megabit chips.  If the 1 megabit chips test OK then we are looking at a BO or TO.

All on track, and I might say that this successful 2nd iteration is an excellent result for share holders.  All IMO of course.