Calling the first batch a failure is far from being a fact.
if 4DS was running on failure, it would not be trading above its recent CR at $0.045 and would not be partnered with Western Digital and IMEC.
Please help point out where it was a failure in the below announcement that was released in relation to the first iteration.
20 September 2018
UPDATE ON IMEC COLLABORATION
4DS Memory Limited (ASX:4DS) (4DS or the Company) advises that it has analysed the first lot of 300mm wafers from imec which were made using the same multi-million dollar state-of-the-art production equipment used by high volume manufacturers of memory. This was the first of a number of planned iterations.
Based on imec and 4DS’ extensive technical analysis, both parties have rapidly identified and will now validatesome process modifications required to enhance the development of the second 300mm wafer lot. It is expected that the planning and development strategy for this wafer lot will begin in the coming weeks and these wafers will be available for analysis in Q1 2019.Iterations of, and refinements to, any new memory production compatible process are typical in the semiconductor industry and were planned for under the detailed schedule of work in the collaboration agreement with imec.
Chief Executive Officer and Managing Director, Dr Guido Arnout, commented “In the Company’s transition to production equipment, identical to that utilised by high volume memory manufacturers, imec and 4DS have learnt to rapidly identify necessary modifications in order to de-risk the latter development cycles which we plan to undertake. A major benefit of this early identification is that we can accelerate the whole collaboration process.”
Chairman, Mr Jim Dorrian, further stated “4DS remains confident that it will demonstrate a production compatible process for its unique Interface Switching ReRAM technology for Storage Class Memory on imec’s megabit test chip on budget and on time (during 2019) as originally envisioned.”ENDS
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