Production figures for 2019 are now 85%,next good news will really open the doors,expect volatility and accumulation till then,For the most part, 300mm wafers are used in high-volume, commodity chips including DRAMs, flash memory and microprocessors. Very recently, some image sensors, power management devices, complex logic and microcomponent ICs with large die sizes have been produced on 300 mm wafers, according to IC Insights.
Three hundred millimeter wafers represent about 57.8% of installed capacity
in chip production and the figure will rise to 70% in 2017.Larger chipmakers, including Samsung, Toshiba and Micron, all use 300mm wafers for most of their chip production. For instance, Toshiba has 100% of its production on 300mm
In a major breakthrough, endurance analysis has shown that 4DS can cycle its Interface Switching ReRAM memory cells into millions of cycles.
4DS Memory (ASX: 4DS) has released a positive update around its work to create a “next generation” gigabyte storage memory after wrapping up testing with its partner, imec.
The company, which is involved in the development of non-volatile memory storage known as ReRAM, provided an update to shareholders on testing work for the functional 300mm wafers.
Under the analysis work completed in Silicon Valley, imec, a nanoelectronics and digital research hub, produced 23 testable 300mm wafers.
