We have a lot to look forward to from now until the end of Q2.
Next set of iterations based on D17 wafers that are fab compliant (Easy work for IMEC and possibly last set of wafers).
Remaining patents cound potentially be granted at any moment.
The JDA with Western Digital, will it again be signed ahead of schedule before the June 30 expiration date or Will Western Digital just perform a takeover/aquisition and continue the collaboration with IMEC themselves under its existing core partnership program.
interesring and exciting near future.
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