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Tower Semiconductors, page-4

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    Rumor or Fact?

    Nice rumor, can only hope there is some truth in it. Tower has Serveral Fabs spread out across the globe and connections to Panasonic. Would make them a sweet first Partner.

    Found this on Wiki:

    Fab 1 6" Migdal Haemek, IsraelEdit

    Fab 1, located in Migdal Haemek, Israel is a 150mm (wafer diameter) facility which was acquired from National Semiconductor in 1993 at the time of Tower Semiconductor’s founding. Since that time, Fab 1 has been significantly modernized and offers process geometries ranging from 1.0-micron to 0.35-micron including CMOS image sensors, embedded flash and mixed-signal technologies.
    Fab 2 8" Migdal Haemek, IsraelEdit

    Fab 2, a 200mm wafer facility was constructed in January 2001, adjacent to Fab 1 in Migdal Haemek, Israel and was designed to operate in geometries of 0.18-micron and below, using advanced CMOS technology.
    Fab 3 8" Newport Beach, CAEdit

    Fab 3, located in Newport Beach, California, United States was acquired by Tower when it merged with Jazz Technologies in 2008. Jazz Semiconductor was formed in 2002 and inherited the 200mm facility that was once operated by Rockwell Semiconductor. At Fab 3, Jazz established industry leading SiGe, BiCMOS and MEMS technologies and expanded upon its heritage for on-shore, specialized foundry services focused on the Aerospace and Defense industry.
    Fab 9 8" San Antonio, TexasEdit

    Fab 9, located in San Antonio, Texas, United States was acquired by Tower in 2016 from Maxim Integrated.
    Additional three fabs through TowerJazz Panasonic Semiconductor Co. (TPSCo)Edit

    TPSCo is 51% owned by Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM) and 49% owned by Panasonic Corporation (NASDAQ ADS: PCRFY, TYO: 6752). TPSCo has three manufacturing facilities in Hokuriku, Japan (Uozu, Tonami, and Arai) which have been producing large scale integrated circuits for over 30 years. Areas of process technology focus include high dynamic range image sensors (CIS and CCD), integrated power devices (BCD, SOI and LDMOS) and high frequency silicon RFCMOS. TPSCo offers both IDMs and fabless companies over 120 qualified silicon process flows on 200mm and 300mm substrates from super micron to 45 nm, as well as internal back end processing, assembly and test services.[citation needed]
 
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